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WINSYS is part of ICETE, the 11th International Joint Conference on e-Business and Telecommunications.
Registration to WINSYS allows free access to all other ICETE conferences.


ICETE 2014 will be held in conjunction with ICSOFT 2014, SIMULTECH 2014 and DATA 2014.

Registration to ICETE allows free access to the ICSOFT, SIMULTECH and DATA conferences (as a non-speaker).

 
The purpose of WINSYS 2014, the International Conference on Wireless Information Networks and Systems, is to bring together researchers, engineers and practitioners interested on information systems and applications in the context of wireless networks and mobile technologies.
Information systems and information technology are pervasive in the whole communications field, which is quite vast, encompassing a large number of research topics and applications: from practical issues to the more abstract theoretical aspects of communication; from low level protocols to high-level networking and applications; from wireless networking technologies to mobile information systems; many other topics are included in the scope of WINSYS.




Conference Co-chairs

Mohammad S. ObaidatFordham University, NY, United States
Andreas HolzingerMedical University Graz, Austria

PROGRAM CO-CHAIRS

Franco DavoliUniversity of Genoa, Italy
Petros NicopolitidisAristotle University, Greece
Dimitrios D. VergadosUniversity of Piraeus, Greece

Keynote Speakers

Seymour GoodmanGeorgia Institute of Technology, United States
Ivona BrandićVienna UT, Austria
Dimitris KaragiannisUniversity of Vienna, Austria
Matteo GolfarelliUniversity of Bologna, Italy
Edgar WeipplUniversity of Vienna, SBA Research, Austria
 

All papers presented at the conference venue
will be available at the SCITEPRESS Digital Library


A short list of presented papers will be selected so that
revised and extended versions of these papers will be
published by Springer in a CCIS Series book

Technically Co-sponsored by:

IEEE   IEEE  


In Cooperation with:

ACM In-Cooperation
ACM SIGDOC  


Proceedings will be submitted for indexation by:

Thomson   INSPEC   DBLP   EI   SCOPUS  

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